🇩🇪 Germany · EU Public Tender
Low temperatur ICB wafer bonder (ISIT03.1) - PR879696-2390-P
🏛️ Fraunhofer-Gesellschaft - Einkauf B12 · 📍 München
0 €
Estimated value
28 November 2025
Deadline
| Contract type | Supplies |
| CPV | 42990000 |
| Deadline | 28 November 2025 |
| Awarded to | SUSS MicroTec Solutions GmbH & Co. KG |
Full tender details, bidder list, market context and related contracts available below.
Data sourced from TED — the Official Journal of the EU.