🇩🇪 Germany · EU Public Tender
Beschaffung einer Wafer Bonding Anlage
🏛️ Halbleiterlabor der MPG · 📍 Garching
—
Estimated value
29 April 2024
Deadline
| Contract type | Supplies |
| CPV | 31712330 |
| Deadline | 29 April 2024 |
Full tender details, bidder list, market context and related contracts available below.
Data sourced from TED — the Official Journal of the EU.