🇩🇪 Germany · EU Public Tender

Rahmenvereinbarung für gehostete Chipdesign-Plattform mit Chipherstellung für das Barkhausen Institut gGmbH

🏛️ Barkhausen Institut gGmbH · 📍 Dresden
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Estimated value
07 July 2025
Deadline
Contract typeSupplies
CPV31700000
Deadline07 July 2025
Full tender details, bidder list, market context and related contracts available below. Data sourced from TED — the Official Journal of the EU.
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