🇩🇪 Germany · EU Public Tender
Beschaffung eines Wafer-Bonding-Systems
🏛️ Technische Universität Berlin - Der Präsident - · 📍 Berlin
279 K€
Estimated value
—
Deadline
| Contract type | Supplies |
| CPV | 31712000 |
| Awarded to | SUSS Micro Tec Lithography GmbH |
Full tender details, bidder list, market context and related contracts available below.
Data sourced from TED — the Official Journal of the EU.