🇩🇪 Germany · EU Public Tender
115 — Flip-Chip Die Bonder
🏛️ RWTH Aachen University · 📍 Aachen
274 K€
Estimated value
—
Deadline
| Contract type | Supplies |
| CPV | 42990000 |
| Awarded to | Hilpert electronics AG |
Full tender details, bidder list, market context and related contracts available below.
Data sourced from TED — the Official Journal of the EU.