🇩🇪 Germany · EU Public Tender
Beschaffung eines Systems aus Aligner und Bonder zum Verbinden von Halbleiter-Wafern und Wafer-Stücken
🏛️ Technische Universität München · 📍 München
350 K€
Estimated value
—
Deadline
| Contract type | Supplies |
| CPV | 42640000 |
| Awarded to | SUSS MicroTec Lithography GmbH |
Full tender details, bidder list, market context and related contracts available below.
Data sourced from TED — the Official Journal of the EU.