🇫🇮 Finland · EU Public Tender
Semi-Automatic Wafer Grinder
🏛️ Markkinaoikeus · 📍 Helsinki
325 K€
Estimated value
—
Deadline
| Contract type | Supplies |
| CPV | 42900000 |
| Awarded to | DISCO HI-TEC EUROPE GmbH |
Full tender details, bidder list, market context and related contracts available below.
Data sourced from TED — the Official Journal of the EU.