🇫🇷 France · EU Public Tender

Acquisition d'un système d'assemblage de composants par la méthode flip-chip (flip-chip bonder)

🏛️ CNRS-Délégation Centre-Est · 📍 Vandoeuvre-lès-Nancy
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Estimated value
17 November 2025
Deadline
Contract typeSupplies
CPV31712100
Deadline17 November 2025
Full tender details, bidder list, market context and related contracts available below. Data sourced from TED — the Official Journal of the EU.