🇫🇷 France · EU Public Tender

Acquisition d'un système d'assemblage de composants par la méthode flip-chip (flip-chip bonder)

🏛️ CNRS-Délégation Centre-Est · 📍 Vandoeuvre-lès-Nancy
394 K€
Estimated value
—
Deadline
Contract typeSupplies
CPV31712100
Awarded toSET CORPORATION SA
Full tender details, bidder list, market context and related contracts available below. Data sourced from TED — the Official Journal of the EU.