🇬🇧 United Kingdom · EU Public Tender
PURCH1715 Provision of a Contract Agreement for a Wafer Bonder
🏛️ University of Glasgow · 📍 Glasgow
300 K€
Estimated value
—
Deadline
| Contract type | Services |
| CPV | 71350000 |
| Awarded to | Applied Microengineering Ltd |
Full tender details, bidder list, market context and related contracts available below.
Data sourced from TED — the Official Journal of the EU.