🇸🇪 Sweden · EU Public Tender
Flipchip bonder for assembly of semiconductor components
🏛️ Chalmers Tekniska Högskola Aktiebolag · 📍 GÖTEBORG
532 K€
Estimated value
—
Deadline
| Contract type | Supplies |
| CPV | 38000000 |
| Awarded to | Finetech GmbH & Co.KG |
Full tender details, bidder list, market context and related contracts available below.
Data sourced from TED — the Official Journal of the EU.